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E*****S
发帖数: 4 | 1 Please send your resume directly to the company HR Specialist:
[email protected]/* */
Location: San Jose, CA, USA
Company: Hermes Microvision Inc. An ASML Company
The company sponsors H1B and provides relocation assistance.
Job title: Sr. Electrical Engineer
Job Descriptions:
Join the development of all the circuits in both board level and IC level,
and sub-system in HMI e-beam wafer inspection tools. The position is focused
on analog and mixed signal circuit design and circuit simulation in both
board level and IC level, print circuit board (PCB) layout, PCB prototyping,
tuning and debugging, ASIC tapeout, pilot production, and technical
document writing. The position may be involved in but not limited to the
design works listed as follows.
1. Ultra low noise high efficient power supplies: voltage and current
source
2. Low noise high voltage power supply
3. Low noise high voltage amplifier
4. Ultra low noise high gain wideband amplifier
5. Variable gain amplifier
6. ADC and DAC application
7. Grounding and shielding design at both PCB level and module level
8. Signal integrity and power integrity design at both PCB level and
module level
9. Analog and mixed signal ASIC design and tapeout
10. Analog and mixed signal ASIC PCB level integration
Job Requirements:
Ph.D. in electrical engineering with at least 2 years of hands-on
experiences in related fields. Hands-on experiences of schematic capture,
schematic level simulation, PCB layout, PCB level simulation, prototyping,
and problem solving. Familiar with test equipments such as multi-meter, SMU,
signal / function generator, oscilloscope, signal / spectral analyzer, and
network analyzer. The successful candidate should be a team player and
should have self motivation, initiative, dedication, and strong
communication skills. The candidate should also have at least six of the
following specific skills or experiences.
1. OPA circuit (board level) design and building experiences and / or OPA
IC design with tapeout experiences. OPA application experiences
2. Signal conditioning circuits design and building experiences for test
equipments, including but not limit to wide band voltage amplifier, wide
band current amplifier, wide band transimpedance amplifier, ADC driver, and
cable driver
3. Variable gain amplifier circuit (board level) design and building
experiences and / or Variable gain amplifier IC design with tapeout
experiences
4. Wide band analog switch (board level) design and building experiences
and / or wide band analog switch IC design with tapeout experiences
5. High speed ADC and DAC IC design with tapeout experiences. ADC IC and
DAC IC application experiences
6. Class D amplifier circuit design and building experiences
7. Switching mode power supply circuit and linear power supply circuit
design and building experiences
8. High accuracy voltage or current reference circuit (board level)
design and building experiences and / or high accuracy voltage or current
reference IC design with tapeout experiences
9. RF circuit (board level) design and building experiences and /or RF IC
design with tapeout experiences
10. Mixed signal circuit (board level) design and building experiences
and / or mixed signal IC design with tapeout experiences
11. Knowledge of device physics for the semiconductor devices such as PIN
and APD for charged particle detection; BJT, JFET and MOSFET for both
switch mode and linear operation
12. Component test, screen, characterization (including passive and
active devices) and model extraction
13. Knowledge and experiences in Board level and module level shielding
and grounding; knowledge and experiences in signal integrity and power
integrity
14. Thick film circuit design and building experiences
15. Semiconductor device packaging design experiences
16. Thermal design for electronic device and / or module |
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