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Job Description • IC package thermal modeling, thermal design, and
thermal characterization • Develope advanced thermal management
technologies for IC packaging and electronic systems • Electronic
system thermal modeling, thermal design, and form-factor thermal evaluation
• Perform product verification and customer application system thermal
tests • Technical support to internal and external customers on
application electronic system thermal design, modeling, testing and
characterization • Generate product thermal specifications. Generate
product thermal application notes. Provide thermal support for product
design verification and reliabity testing • Maintain product thermal
database
Job Requirements • Advanced degrees (MS or Ph.D.) with major in
thermal-fluids science • Experience in computational fluid dynamics (
CFD) and computational heat transfer. Advanced knowledge and work experience
with numerical methods in engineering and mathematics, strong analytical
skills in thermal management analysis • Minimum 2-years experiences in
Icepak modeling of electronic components and electronic systems •
Experience with thermocouple, IR, and other methods for IC device
temperature characterization • Experience in package/board/system
level thermal design, thermal modeling, and cooling technologies •
Theory and experience in TIM for electronic applications • Basic
understanding of electronic circuits and IC packaging technologies •
Educational background in electronic package design, package environmental
tests, and packaging materials • Basic understanding of electronic
device reliability tests • Strong communication skills • Strong
analytical and organizational skills; attention to details in engineering
analysis and project management
Country United States
State/Province California
City/Town Irvine |
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