d**********1
发帖数: 329 | 1 Responsibilities:
- signal and power integrity analysis and optimization of passive on-chip,
package, and PCB structures
- interface and work with layout contractors on new high speed flip-chip
package and PCB designs
- characterization of packages and PCBs in the lab
- analyze measurement data and compare with simulation results for
troubleshooting and optimizing package and PCB designs
- model development for high speed I/Os (HSPICE, AMI, etc.)
Requirements:
- MSEE with 3 years of experience o |
n***r
发帖数: 105 | 2 隔行如隔山啊。不懂
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
|
g********n
发帖数: 2314 | 3 公司大小，所在行业，待遇情况。
就算招新毕业生，这些信息还是不能缺。
BTW ,发si-list比发到三藩版强。 |
m********r
发帖数: 543 | 4 what's si-list?
【在 g********n 的大作中提到】
: 公司大小，所在行业，待遇情况。
: 就算招新毕业生，这些信息还是不能缺。
: BTW ,发si-list比发到三藩版强。
|
x***m
发帖数: 1733 | 5 what is si-list?
【在 g********n 的大作中提到】
: 公司大小，所在行业，待遇情况。
: 就算招新毕业生，这些信息还是不能缺。
: BTW ,发si-list比发到三藩版强。
|
U*G
发帖数: 364 | 6 懂点皮毛行不行，很想转硬功
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
|
k****t
发帖数: 2288 | 7 能办理身份吗?
【在 d**********1 的大作中提到】
: Responsibilities:
: - signal and power integrity analysis and optimization of passive on-chip,
: package, and PCB structures
: - interface and work with layout contractors on new high speed flip-chip
: package and PCB designs
: - characterization of packages and PCBs in the lab
: - analyze measurement data and compare with simulation results for
: troubleshooting and optimizing package and PCB designs
: - model development for high speed I/Os (HSPICE, AMI, etc.)
: Requirements:
|
d**********1
发帖数: 329 | |
c****n
发帖数: 587 | 9 楼主给点具体的吧，要是动心了就去写简历，呵呵
公司大小，所在行业，待遇情况。 |
d**********1
发帖数: 329 | 10 能办理身份
【在 k****t 的大作中提到】
: 能办理身份吗?
|
