n*****a
发帖数: 313 | 1 Tezzaron is the world leader in three-dimensional integrated circuits (3D-
ICs) design and fabrication.
As a Tezzaron intern, you will work with experienced chip designers on the
leading edge of the semiconductor industry. You get hands-on experience with
high performance mixed signal 3D-IC designs. You do not just"shadow" the
engineers; you contribute directly to our ground-breaking projects.
Our internships feature team-building activities with the intern group and
with the engineering department. "Lunch and Learn" sessions explore topics
such as 3D memory architecture, 3D-IC processing, analog design techniques,
verification methodologies, and the latest EDA software.
We are now accepting applications for two engineering internships to begin
in January 2015 and extend through June. We want highly accurate and detail
oriented individuals with a vigorous work ethic – people who do what it
takes to achieve success on schedule.
Duties:
o Design 3D-IC layouts using submicron CMOS processes
o Debug designs using latest verification methodologies
Requirements:
o Junior, Senior, or grad student in Computer Engineering or EE
o Knowledge of Unix/Linux, Verilog, and scripting languages
o Excellent communication and problem solving skills
o Course work in VLSI and logic design
o Experience in IC layout design is a plus
Hours and Term:
o January 2015 through June 2015
o Full time (40+ hours per week)
o Overtime is paid (and encouraged)
Location o Naperville, Illinois
To Apply for this Position
Communication skills are very important. Please craft a compelling cover
letter detailing your relevant coursework and experience; explain how this
internship fits your career plans.
Your resume must include your grade point average, your GRE score, and your
work authorization (US citizenship,permanent residency, F-1 visa, etc.).
Send your résumé and cover letter to Tezzaron by email at careers@tezzaron
.com |
|
