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d***a
发帖数: 73 | 1 Please reply to mailbox for further inquiry/Referral.
Please Note job opening is for PHD RCG (18 month prior or post graduation
date) only. Candidates with chem, polymer, materials science background are
encouraged
to apply.
Description
Job Description: Packaging Engineers provide package development and
sustaining support for integrated circuit or semiconductor assemblies,
various other electronic components and/or completed units. Conducts tests
and research on basic materials and properties. Establishes material
specifications for contract assemblers and raw material vendors and
interfaces with Quality Assurance and Purchasing regarding material quality
and vendor performance. Provides consultation concerning packaging problems
and improvements in the packaging process. Responds to customer/client
requests or events as they occur. Develops solutions to problems utilizing
formal education and judgement.
Qualifications
You must possess a Ph. D. in Material Science or a Master of Science degree
in Material Science with more than two years of relevant working experience
. Additional qualifications include:
- Excellent working experience in handling analytical tools
- Working experience in relationship between processing vs. microstructure
vs. mechanical and physical properties of materials (polymers, composites,
metals and ceramics)
- Working knowledge in fracture and adhesion mechanisms of materials and
material interfaces
- Working knowledge in fundamentals of materials science and engineering
- Excellent knowledge in metal solidification process/phase diagrams,
polymerization, deformation of materials, and material development
- Good problem-solving, data analysis, statistical design, and analysis
skills
- Good communication skills
- Ability to work in a team environment across multi-geographies
- Ability to travel overseas extensively
Job Category
Primary Location
Organization
Full/Part Time | l*****x
发帖数: 3431 | 2 "Ability to travel overseas extensively" means at least GC?
are
【在 d***a 的大作中提到】
: Please reply to mailbox for further inquiry/Referral.
: Please Note job opening is for PHD RCG (18 month prior or post graduation
: date) only. Candidates with chem, polymer, materials science background are
: encouraged
: to apply.
: Description
: Job Description: Packaging Engineers provide package development and
: sustaining support for integrated circuit or semiconductor assemblies,
: various other electronic components and/or completed units. Conducts tests
: and research on basic materials and properties. Establishes material
| l******s
发帖数: 1276 | 3 why PHD? is this Intel Labs?
graduation
are
tests
【在 d***a 的大作中提到】
: Please reply to mailbox for further inquiry/Referral.
: Please Note job opening is for PHD RCG (18 month prior or post graduation
: date) only. Candidates with chem, polymer, materials science background are
: encouraged
: to apply.
: Description
: Job Description: Packaging Engineers provide package development and
: sustaining support for integrated circuit or semiconductor assemblies,
: various other electronic components and/or completed units. Conducts tests
: and research on basic materials and properties. Establishes material
| B******R
发帖数: 593 | 4 sent into your inbox just now | P******e
发帖数: 344 | 5 should work with Shanghai Backend Fabs.
Like Amkor or Statschippac
why PHD? is this Intel Labs?
graduation
are
tests
【在 l******s 的大作中提到】
: why PHD? is this Intel Labs?
:
: graduation
: are
: tests
| g******u
发帖数: 3060 | 6 Does Intel have labs in CA or NC?
are
【在 d***a 的大作中提到】
: Please reply to mailbox for further inquiry/Referral.
: Please Note job opening is for PHD RCG (18 month prior or post graduation
: date) only. Candidates with chem, polymer, materials science background are
: encouraged
: to apply.
: Description
: Job Description: Packaging Engineers provide package development and
: sustaining support for integrated circuit or semiconductor assemblies,
: various other electronic components and/or completed units. Conducts tests
: and research on basic materials and properties. Establishes material
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